no. if you want to do component level board repair for water damge, this is how you do it professionally. I’ve been using this strategy for 5 years or so now and it has much better success rates than just cleaning the board with ipa.
maybe overkill for most people since it requires more specialized tools but if you go to a shop they’ll most likely use similar techniques at least to assess the damage
depends on the type of solder but yeah, I’m not exactly holding it there tho. just high airflow at that temp for a few seconds to push the rosin underneath the chips. helps a lot with bga chips where water can actually get underneath the chip and short connections or leave debris even once evaporated. for actually reworking chips I use around 480c.
no. if you want to do component level board repair for water damge, this is how you do it professionally. I’ve been using this strategy for 5 years or so now and it has much better success rates than just cleaning the board with ipa.
maybe overkill for most people since it requires more specialized tools but if you go to a shop they’ll most likely use similar techniques at least to assess the damage
I mean, solder melts at temperatures lower than 300 degrees Celsius.
depends on the type of solder but yeah, I’m not exactly holding it there tho. just high airflow at that temp for a few seconds to push the rosin underneath the chips. helps a lot with bga chips where water can actually get underneath the chip and short connections or leave debris even once evaporated. for actually reworking chips I use around 480c.